In the PCB backlight system development work, heat dissipation is a very important research topic, because the current LED will produce more in addition to the light and heat, the heat will be seriously affected.

Luminescent properties of LED in order to improve the radiating performance of the PCBbacklight system, two aspects can be considered: to improve the radiating performance of the single LED. To improve the radiating performance of the LED array.

As a PCB circuit board of backlight system designers, we choose second schemes to solve the problem of heat dissipation. In order to improve the heat dissipation performance of the LED array system. Cooling method: use a fan to increase the air flow velocity around thebacklight system. To reduce the thermal resistance from junction to ambient. The backlightmodule design in the economy, the heat conduction substrate printed circuit board radiating performance outstanding is a better solution.

Is now widely used conventional polymer insulated metal substrate (IMS) technique usingpolymer or epoxy resin material as insulating layer, this technique requires special treatment to the surface of the metal base, and the minimum thickness of insulation layer is about 75microns, which will increase the heat resistance of the whole insulated metal substrate. In addition, the traditional IMS technology will produce the insulating layer and the metal substrate stratification phenomenon under high temperature.